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Ceramic Thickfilm PCB Ceramic Printed Circuit Board Item No R0028 Ideal Solution for Power Electronics and RF Modules Applications

Ceramic Thickfilm PCB Ceramic Printed Circuit Board Item No R0028 Ideal Solution for Power Electronics and RF Modules Applications

ceramic thickfilm PCB for power electronics

ceramic printed circuit board for RF modules

ceramic PCB board with warranty

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Dettagli del prodotto
Type:
Ceramic Thickfilm PCB
Substratetype:
Ceramic
Size:
2mm~200mm
Thickness:
0.1mm - 3.0mm
Productname:
Ceramic PCB Board
Application Segment:
Auto,Industrial,Medical,DataCom、Comsumer
Item No:
R0028
Dielectricconstant:
7-9
Evidenziare:

ceramic thickfilm PCB for power electronics

,

ceramic printed circuit board for RF modules

,

ceramic PCB board with warranty

Termini di pagamento e di spedizione
Descrizione del prodotto
Ceramic Thickfilm PCB (Item No: R0028)
High-quality ceramic printed circuit board designed for power electronics and RF modules applications, offering exceptional thermal management, mechanical strength, and reliability.
Product Overview
This Ceramic Thickfilm PCB features impressive thickness versatility from 0.1mm to 3.0mm, with a standard thickness of 1.6mm that balances durability and compactness. The Al2O3 ceramic base material provides excellent thermal conductivity and electrical insulation, while the copper cladding ensures efficient signal transmission.
Key Advantages
  • Superior thermal conductivity (20-30 W/mK)
  • Excellent mechanical stability and corrosion resistance
  • Advanced thick film technology for precise patterning
  • Suitable for harsh environments including industrial, aerospace, and military applications
Technical Specifications
Parameter Specification
PCB Thickness 1.6mm (0.1mm - 3.0mm range)
Application Segments Auto, Industrial, Medical, DataCom, Consumer
Dielectric Constant 7-9
Certificates ISO9001, ISO14001, IATF16949, UL
Substrate Type Ceramic
Copper Thickness 18µm - 105µm
Surface Finish ENIG, HASL, Gold Plating
Size Range 2mm - 200mm
Layer Count 1-4 Layers
Primary Applications
  • High Power Electronics: Power amplifiers, power supplies, and modules requiring effective heat dissipation
  • LED Lighting: Automotive lighting, street lighting, and high-intensity LED arrays
  • RF Modules: Communication devices, radar systems, and RF applications
Customization Options
We offer comprehensive customization services including DBC, DPC, LTCC, and HTCC processes to meet specific application requirements across automotive, industrial, medical, data communication, and consumer electronics segments.
Handling & Support
For optimal performance, avoid mechanical stress and use precise temperature control during soldering. Keep boards clean and free from contaminants. Comprehensive technical support and detailed documentation available for all projects.

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